Electronic Product Development and Design

Electronic product development requires coordinated workflows across hardware design, software development, and structural engineering. At CONSONS Group, we oversee every stage from initial product definition and proof of concept to detailed hardware schematics, Bill of Materials (BOM) planning, embedded software integration, and enclosure/mechanical design. Our integrated approach ensures seamless collaboration between components—circuit boards, software, and enclosures—reducing errors, accelerating prototyping, and shortening time-to-market. To ensure manufacturing readiness and product reliability, our designs adhere to PCB and PCBA industry standards published by IPC, the global authority in electronic manufacturing. By combining technical expertise with structured processes, we empower clients to confidently bring reliable, high-quality electronic products from concept to market. With over 19 years of R&D and design experience, our team has accumulated extensive expertise in smart home systems, motors and motor control, and home appliances. Our case library enables rapid adaptation to relevant product categories, accelerating new product development.

Electronic product development process:

l Product Definition

l Proof of Concept (PoC)

l hardware design

l software integration

l structural shell design

l Assessment and Debugging

l Sample creation

l Small batch trial production and mass production

hardware design

Objective: To develop electronic hardware that ensures performance, reliability, and manufacturability.

Core activities:

Design and Verification of Schematic Diagram

Component Selection and Bill of Materials Preparation

PCB Layout Considering Signal Integrity, Electromagnetic Compatibility (EMC) and Thermal Management

Feasibility Review of DFM/DFT for Mass Production

hardware verification planning

Key outputs: circuit diagrams, PCB files, bill of materials, hardware verification plan

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Product Definition

Objective: Define the product concept, functional requirements, market positioning, and cost objectives.

Core activities:

Brainstorming and Preliminary Concept Generation

Definition of Function Specification,Performance Target and Cost Analysis

Draw a system block diagram and specify major interfaces and communication requirements

Preliminary product appearance design (industrial design)

Key outputs: Product requirements document, system block diagram, initial design concept

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Proof of Concept (PoC)

Objective: To validate the feasibility of the product concept and reduce technical risks.

Core activities:

Verify key technologies and core functions

Quickly build a basic performance test prototype

Preliminary firmware testing for software and hardware integration

Assess risks and provide optimization suggestions

Key outputs: Proof of Concept (PoC) test report, technical feasibility analysis, and improvement proposals

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hardware design

Objective: To develop electronic hardware that ensures performance, reliability, and manufacturability.

Core activities:

Design and Verification of Schematic Diagram

Component Selection and Bill of Materials Preparation

PCB Layout Considering Signal Integrity, Electromagnetic Compatibility (EMC) and Thermal Management

Feasibility Review of DFM/DFT for Mass Production

hardware verification planning

Key outputs: circuit diagrams, PCB files, bill of materials, hardware verification plan

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software program development

Objective: To develop firmware and applications to enable hardware features.

Core activities:

Firmware Architecture Planning and Module Division

Drive development (GPIO, UART, SPI, I2C, etc.)

Application Logic and System Workflow Implementation

Communication protocol integration (BLE, Wi-Fi, CAN, Modbus)

Hardware Debugging and Firmware Optimization

Key outputs: firmware source code, drivers, application logic, and test versions

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Design of the outer shell and internal structure, mechanical structure design

Objective: To design the product shell and mechanical structure, considering both aesthetics and functionality.

Core activities:

The Industrial Design Concept of Product Appearance

Internal Layout and Component Installation

Selection of materials and manufacturing processes (e.g., injection molding, CNC, stamping, etc.)

Thermal and Structural Analysis of Durability and Heat Dissipation for Mass Production DFM Optimization

Primary outputs include 3D models, 2D drawings, and prototype files in STP format.

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Assessment and Debugging

Objective: To verify functionality and reliability, and to correct potential issues.

Core activities:

Hardware Testing and Debugging

Firmware Testing and Optimization

Mechanical Structure, Assembly and Tolerance Check

Reliability testing (heat, vibration, life cycle)

EMC/ESD Compliance Pre-Check

Key output: EVT/DVT test report, problem resolution plan

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Sample preparation

Objective: To create physical prototypes to test functionality and user experience.

Core activities:

Engineering Prototype Manufacturing (EVT/DVT/PVT)

Small-batch Printed Circuit Board and Enclosure Production

assembly and structural installation verification

System Integration and Performance Evaluation

Key outputs: complete sample unit, test report, and improvement suggestions

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small batch trial production

Objective: To ensure a smooth transition from product design to production.

Core activities:

Prepare production lines, fixtures, and test fixtures

Conduct pilot operations to validate the process and yield

Establish quality control standards (IQC/IPQC/FQC/OQC)

Complete production documentation and testing procedures

Key outputs: PVT report, production documentation, and batch production preparation status

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volume production

Objective: To achieve stable, large-scale production while ensuring quality and delivery.

Core activities:

Full-scale Manufacturing and Quality Control

continuous process optimization

supply chain and material management

Key outputs: finished products, production reports, stable deliveries

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